上海奥硅科半导体科技有限公司

Fully Automatic LED-UV Curing Machine

The UVL400 is an automatic UV de-bonding device for loading frames, removing tape, and unloading. This device is compatible with 8” and 12” wafer frames and does not require fixture replacement.  Main Machine Structure: - Surface light source LED UV lamp - Independent LED lamp power supply system - Cassette automatic loading and unloading mechanism - Lid sealing with nitrogen purging mechanism - Automatic stamping mechanism Technical Advantages: - LED surface light source illumination with uniformity within 5% - Nitrogen purging function for better de-bonding results - High-power illumination, achieving approximately 300 mJ/cm² exposure energy in about 7 seconds on average - Fully imported LED chips with a designed lifespan of over 20,000 hours, balanced and stable power, ultra-long lifespan (LED lamp warranty for two years)
QM600 Series Fully Automatic QFN Strip mount

The QM600 series fully automatic laminating machine is used to apply a layer of tape together with the frame on QFN products after plastic sealing, serving as a supporting carrier for the chip in subsequent cutting processes.  Main features of the machine: - Loading via magazine, unloading via cassette. - Automatic product width detection in the magazine, with automatic adjustment by the machine to apply tape to products of the corresponding width.  - Can transmit data in real-time with the customer's control center. - Automatically recognizes QR codes on products, and applies labels automatically after laminating. - Can pre-load multiple magazines and two cassettes. - Can be designed to be compatible with multiple products without the need to change molds.
Fully Automatic Laser Marking Machine

This device is used to print 2D barcodes or QR codes on substrates or metal frames and is suitable for products such as QFN and DFN. Main machine structure: - Stacking feeding mechanism - Paper-separating and handling function - Material recognition function - Gripper handling mechanism - Transmission mechanism - Automatic inspection function - Laser area function - Material collection function Technical advantages: - Optional product stacking and magazine feeding modes - Can support multiple material boxes as backup, reducing manual operation frequency - Information such as front and back sides is detected by CCD, greatly reducing error rates - CCD re-checks 2D marks after marking to prevent errors - Can transmit data to the customer's system in real time
Auto Scraper Machine

This device is designed for automatically stripping and peeling the UV tape from pre-cut products, suitable for applications such as QFN and DFN packages.   Technical advantages: Three-axis programmable servo drive mechanism for X, Y, Z axes Product transfer mechanism Ultrasonic Vibrator and Its Controller Material collection mechanism (Automatic material collection mechanism (Flushing mechanism))
WM368 Floor-Mounted Wafer Mounting Machine

This wafer laminating machine is suitable for applying blue tape to semiconductor wafers before cutting. It is a semi-automatic device with manual loading and unloading, and automatic tape lamination. Product Advantages: 1. The workbench can handle products of 4, 6, and 8 inches. 2. Saves tape usage.
UPC-2000L CO2 Bubbler

The CO2 foaming machine is suitable for the semiconductor wafer cutting process. It works by infusing CO2 to lower the resistivity of water (reaching 0.2 MΩ·cm), thereby eliminating static electricity in the water and protecting the wafer. Product Advantages: 1. Precise resistivity control capability, able to maintain resistivity within ±0.1 MΩ·cm. 2. Equipped with an automatic resistivity adjustment system.